2025-09-03
AlixLabs AB (AlixLabs) is a Sweden-based deep-tech startup focused on revolutionizing semiconductor manufacturing through its unique and patented approach to Atomic Layer Etching Pitch splitting (APS). AlixLabs won the Smart Manufacturing category of IC Taiwan Grand Challenge (ICTGC) Batch 3 with their Atomic Layer Pitch Splitting (APS) technology: a breakthrough equipment solution for advanced semiconductor manufacturing, which offers a disruptive, sustainable method for advancing semiconductor scaling.
Smaller Semiconductors Need Better Manufacturing Methods
As semiconductor sizes continue to shrink further and their complexity increases, so too will the cost for semiconductor design and manufacturing. In 2015, an article published in IEEE raised concerns about the manufacturing of sub-10 nm semiconductors, which could impact the robustness, reliability, and resiliency of embedded and critical systems. The stochastic nature of the production methods at the time was thought to contribute to these vulnerabilities. To produce sub-10 nm semiconductors, cutting-edge techniques such as extreme ultraviolet (EUV) lithography are vital, but it is known to be both complex and expensive, significantly increasing the production costs. AlixLabs’ APS (Atomic Layer Etch Pitch Splitting) technology aims to present a cost-effective and sustainable solution for the scaling of nanoscale features.
Introducing IC Taiwan Grand Challenge
To strengthen Taiwan’s position as a global semiconductor powerhouse, the National Science and Technology Council (NSTC) organizes the IC Taiwan Grand Challenge. Started in 2024, the competition originally focused purely on innovative IC designs and advanced application solutions. Today, ICTGC also honors technologies that can support and contribute to the semiconductor industry and Taiwan’s industry in general. ICTGC Batch 3 emphasizes key fields such as AI Core Technologies & Chips, Smart Mobility, Smart Manufacturing, Smart Medtech, and Sustainability.
Redefining Nanoscale Features Fabrication
AlixLabs AB (AlixLabs) was founded in 2019 as a spin-off from Lund University and RISE ProNano. Focusing on revolutionizing semiconductor manufacturing through its unique and patented approach to Atomic Layer Etching Pitch splitting (APS), AlixLabs boasts a team of highly experienced professionals with strong academic and industrial backgrounds. The team includes PhD-level experts in chemistry, nanotechnology, and semiconductor physics, with deep experience in both research and commercialization.
The core technology of AlixLabs is Atomic Layer Etch Pitch Splitting (APS), a patented semiconductor manufacturing method that enables sub-10nm patterning without requiring expensive EUV lithography or multiple patterning steps. The technology leverages Atomic Layer Etch (ALE) principles to selectively split line patterns with atomic-scale precision and provide an efficient path to high-resolution structures in both logic and memory devices. It is ideal for advanced logic and memory nodes, compound semiconductor devices, and cost-sensitive applications where traditional EUV or multi-patterning approaches might prove too costly or limiting. The APS technology aims to solve existing pain points in sub-10 nm semiconductor manufacturing processes by eliminating the need for multiple patterning, providing finer feature sizes, reducing energy & material usage, enabling high-density patterning on sensitive materials, and improving manufacturability and scalability in logic, memory, & power electronics.
AlixLabs’ APS Technology has been successfully demonstrated on United Microelectronics Corporation (UMC) wafers through an ongoing collaboration. Solving the challenges of advanced patterning by replacing costly and complex multiple patterning steps with a simpler, self-aligned, atomic-layer etch process, the APS technology offers scalability, material selectivity, and industrial validation, making it a future-ready solution for next-generation chip manufacturing.
As the winner of the Smart Manufacturing category in the IC Taiwan Grand Challenge Batch 3, AlixLabs will participate in the Taiwan Innotech Expo (TIE) 2025, which will be held from October 16 – 18, 2025, in the Taipei World Trade Center (TWTC) Hall 1. AlixLabs will showcase their innovative APS Technology, and visitors are encouraged to join and see how their innovations will redefine nanoscale feature fabrications by combining atomic-level precision, reduced process complexity, and wide material compatibility into a single, scalable platform.
Register for the IC Taiwan Grand Challenge Batch 4
With the continued success of the IC Taiwan Grand Challenge (ICTGC), the organizers will promote it as a long-term event to support semiconductor innovations from Taiwan and abroad. Registration for the next batch of ICTGC will begin in November 2025, and teams with a focus on semiconductor technologies are encouraged to join and compete.
For more details, please visit:
Keen to meet the winners?
Unveil Event Open to Register!
- DATE: 10/18(Sat.) 13:00-14:30
- VENUE: Taipei World Trade Center Exhibition Hall (TWTC) Halls 1, TIE Expo, FUTEX Stage
- REGISTER NOW: https://seminars.tca.org.tw/D11p00262.aspx
