2025-09-03
3D Architech is a US-based team that started out as a Caltech spin-off that has received competitive public funding, including Japan’s prestigious NEDO SBIR grant and selection into the Kawasaki Deep Tech Accelerator. They offer pioneering 10-micron resolution metal 3D printing for advanced cooling and energy components. Enabling up to 60% energy savings in AI chip cooling and 30% efficiency gains in hydrogen production, 3D Architech won the Sustainability category of IC Taiwan Grand Challenge (ICTGC) Batch 3. Their gel-based metal additive manufacturing process allows for the fabrication of highly efficient, customized geometries optimized for thermal and fluid performance.
Modern Technology Needs Better Cooling
AI data centers are well-documented to produce a significant amount of heat, with an article pointing out that a standard AI server rack will produce as much heat as anywhere between 10 to 25 ovens running simultaneously. As data centers grow larger and denser, conventional air cooling methods that are already deemed insufficient to properly cool the facility will inevitably struggle to fulfill their role even more. A common workaround today is utilizing liquid cooling to rapidly disperse heat effectively and efficiently. However, this method will also reach a threshold that will render it sub-optimal. By enabling innovative application of micro-architected metal structures to solve the growing need for better thermal and energy management, 3D Architech’s 10-micron resolution metal 3D printing allows for complex, chip-specific cooling designs and engineered porous metals that significantly enhance performance.
Introducing IC Taiwan Grand Challenge
To strengthen Taiwan’s position as a global semiconductor powerhouse, the National Science and Technology Council (NSTC) organizes the IC Taiwan Grand Challenge. Started in 2024, the competition originally focused purely on innovative IC designs and advanced application solutions. Today, ICTGC also honors technologies that can support and contribute to the semiconductor industry and Taiwan’s industry in general. ICTGC Batch 3 emphasizes key fields such as AI Core Technologies & Chips, Smart Mobility, Smart Manufacturing, Smart Medtech, and Sustainability.
Solving Critical Thermal and Fluid Inefficiencies with Better Cooling Solutions
3D Architech was founded in 2022 as a Caltech spin-out deep-tech startup based in the US that has also received competitive public funding, including Japan’s prestigious NEDO SBIR grant and selection into the Kawasaki Deep Tech Accelerator. Developing next-generation 3D metal manufacturing technology to address urgent challenges in electronics cooling and energy systems, the 3D Architech team combines deep expertise in materials science, microfabrication, and thermal engineering. Their technical team possesses deep expertise in materials science, microfabrication, and thermal engineering. Supported by strategic advisors from the semiconductor and data infrastructure industries and in collaboration with metal suppliers and manufacturers across the US and Japan, 3D Architech is seeking to expand partnerships in Taiwan to integrate their technology into Taiwan’s semiconductor and advanced packaging ecosystem.
3D Architech has secured multiple patents covering gel-based metal additive manufacturing and micro-architected designs. They are also actively collaborating with their global partners: developing and validating advanced cooling devices for high-power AI chips in the US and working on proof-of-concept projects with top-tier companies in Japan.
3D Architech’s proprietary gel-based metal additive manufacturing enables 10-micron resolution, which is 10x finer than conventional metal 3D printing methods. This enables users to create high-efficiency, customized geometries optimized for thermal and fluid performance. This is an important feature in applications such as AI chip cooling, semiconductor packaging, and green hydrogen electrolyzers. Featuring 100x lower equipment cost compared to laser or electron beam-based production systems, 3D Architech’s technology makes scalable and cost-effective production a reality.
As the winner of the Sustainability category in the IC Taiwan Grand Challenge Batch 3, 3D Architech will participate in the Taiwan Innotech Expo (TIE) 2025, which will be held from October 16 – 18, 2025, in the Taipei World Trade Center (TWTC) Hall 1. 3D Architech will showcase their innovative gel-based metal additive manufacturing for advanced cooling and energy components. Visitors are encouraged to join and see how their innovations will enable the fabrication of highly efficient, custom-designed microstructures for cooling applications in key technologies, including AI chips, AI data centers, and green hydrogen electrolyzers.
Register for the IC Taiwan Grand Challenge Batch 4
With the continued success of the IC Taiwan Grand Challenge (ICTGC), the organizers will promote it as a long-term event to support semiconductor innovations from Taiwan and abroad. Registration for the next batch of ICTGC will begin in November 2025, and teams with a focus on semiconductor technologies are encouraged to join and compete.
For more details, please visit:
Keen to meet the winners?
Unveil Event Open to Register!
- DATE: 10/18(Sat.) 13:00-14:30
- VENUE: Taipei World Trade Center Exhibition Hall (TWTC) Halls 1, TIE Expo, FUTEX Stage
- REGISTER NOW: https://seminars.tca.org.tw/D11p00262.aspx
