2025-08-29
Driving Innovation Across AI Chips & Applications, Semiconductor Manufacturing, Smart Healthcare, and Low-Earth Orbit Satellites
The National Science and Technology Council (NSTC) announced the eight winning teams of the third batch of the IC Taiwan Grand Challenge (ICTGC). The selected startups include:
femtoAI (USA): Sparse Processing Unit 001 (SPU-001)
3D Architech, Inc. (USA): Metal manufacturing for energy efficiency improvement
HyperAccel (Korea): Bertha-Edge (BerthaE) AI chip designed to enable Generative and Agentic AI
DeepMentor Inc. (Taiwan): CNN AI IP-DeepLogCore & LLM AI IP-DeepTransformCore & AI Tools-DeepExpert
Brilliant Silicon Technology Co., Ltd. (Taiwan): RF Chipset for Low Earth Orbit (LEO) user terminal
EndoSemio Co., Ltd. (Taiwan): NBI Fusion AI-Powered ENT Endoscope: Next-Gen Nasopharyngeal Cancer Early Detection
AlixLabs AB (Sweden): Atomic Layer Pitch Splitting: a breakthrough equipment solution for advanced semiconductor manufacturing
PurCity ApS (Denmark): GapS panels for sustainable air purification
These eight winners will showcase their solutions at the Future Tech Pavilion, Taiwan Innotech Expo (October 16–18, 2025), expected to accelerate innovation in AI chips and applications, semiconductor manufacturing, smart healthcare, LEO satellites, and more.
Highlights from Winning Teams
Semiconductor Manufacturing Breakthroughs
AlixLabs AB developed a patented Atomic Layer Pitch Splitting (APS) technology, a plasma-based etching method that selectively etches surface topographies. This innovation streamlines multiple complex steps in semiconductor manufacturing, enabling more efficient, cost-effective, and sustainable chip production.
Next-Generation AI Chips & Edge AI
femtoAI from the United States introduced a Sparse Processing Unit 001 (SPU-001) leveraging sparsity to skip unnecessary computation and storage—reducing memory use by up to 10x and improving energy efficiency by 100x. The SPU integrates custom AI accelerator chips and production-ready algorithms for real-time AI in everyday devices.
HyperAccel from Korea developed Bertha-Edge (BerthaE), an AI chip designed for edge generative AI and agent AI. By optimizing memory access, data flow, computing resources, and inter-chip networks, it overcomes bottlenecks in LLM inference, delivering high-performance edge AI computing.
DeepMentor from Taiwan presented its patented AI model miniaturization technology, reducing the computation load of large cloud AI models by 90% while maintaining over 99% accuracy. Its automated AI chip design flow converts AI algorithms directly into chip circuits, cutting AI IP development time, while its end-to-end AI deployment platform provides a full pipeline from data preparation to deployment.
Smart Healthcare & Sustainable Applications
Endosemio from Taiwan launched an AI-powered miniature ENT endoscope that integrates narrow-band and white-light imaging to highlight vascular changes linked to early nasopharyngeal cancer. Powered by CNN+LSTM AI models trained on large clinical datasets, the device enables rapid, real-time detection of high-risk lesions, advancing early cancer screening in ENT clinics.
PurCity ApS from Denmark developed patented GapS panels, which replace traditional building façades to naturally ventilate and purify polluted air via harmless chemical processes. When integrated with HVAC systems, GapS provides cleaner, cooler air while reducing energy consumption by up to 60%. The entire system leverages AI/ML to optimize performance.
Advanced Materials & Satellite Technology
3D Architech from the United States developed a patented gel-based metal 3D printing process capable of micron-scale porous metal structures. These structures enhance fluid and gas flow, enabling better cooling for AI chips (cutting energy use by 60%) and boosting hydrogen production efficiency by 30%.
Brilliant Silicon (BSi) from Taiwan introduced CMOS RF chip solutions that reduce chip area and power consumption while improving antenna utilization and beam control efficiency. These solutions strengthen Taiwan’s capabilities and competitiveness in Low Earth Orbit (LEO) satellite communications.
Call for Batch 4 Applications
The 4th batch of the IC Taiwan Grand Challenge will officially open for applications on November 1, 2025, with submissions accepted until the end of February 2026.
Winning teams will receive a USD $30,000 soft-landing grant from NSTC, along with opportunities to connect with Taiwan’s leading industrial partners and manufacturers. Additional benefits include mentorship from senior semiconductor experts and guidance from top-tier venture capital professionals.
NSTC will continue to leverage Taiwan’s semiconductor ecosystem through ICTGC, fostering global IC innovation, accelerating industry transformation, and strengthening international market connections.
For more information and registration, please visit the IC Taiwan Grand Challenge official website: https://ictaiwanchallenge.org/
[Press Contact]
Mr. Jacky Chen, Taipei Computer Association (TCA)
Tel: +886-2-25774249 #940
Email: jacky_chen@mail.tca.org.tw
